SonicEdge unveils ST100M acoustic module for next-gen earphones

SonicEdge has begun limited sample distribution of its new ST100M integrated audio module for earphones and wearable devices.

The ST100M, branded as the acoustic core of the SonicTwin product range, is being positioned for evaluation by select partners within the wearable technology sector as a micro-acoustic solution that incorporates both speaker and microphone in a compact form factor.

Product details

The ST100M is a hybrid acoustic module, packaging a high-fidelity MEMS speaker alongside a precision microphone in a single, unified, surface-mount package measuring 8x4x1mm. This is intended to occupy up to ten times less volume than comparable discrete audio components, according to the company. By reducing the internal space requirements, SonicEdge claims manufacturers may design earbud and wearable devices that are smaller, more comfortable for all-day use, or house larger battery capacities.

The device uses SonicEdge's patented sound-from-ultrasound technology, designed to eliminate the mechanical barriers seen in traditional earphone design. By employing modulated ultrasound to produce sound, the ST100M avoids mechanical vibration. The absence of vibration, the company notes, results in lower noise and structural interference, allowing simultaneous operation of both speaker and microphone within the same space-an integration not possible with established voice coil technology.

Another highlighted feature is the ST100M's co-located transducer and sensor configuration, which the company says helps eliminate structural noise and reduce both audio latency and group delay within an active noise cancellation (ANC) control loop. This arrangement is described as delivering ANC performance that is intended to be faster and more stable across the entire frequency range.

The ST100M also delivers what SonicEdge describes as flagship audio fidelity, with claimed support for high sound pressure levels from 5Hz to 50kHz and minimal total harmonic distortion. The module is compatible with surface-mount technology assembly lines, integrating into existing manufacturing workflows for portable audio devices.

Comments from leadership

"The ST100M is a complete, digital acoustic module that doesn't just improve audio, it completely re-architects the possibility of wearable design," said Moti Margalit, CEO at SonicEdge. "We're thrilled with the initial feedback from our first wave of partners, and by expanding our sampling, we are offering more early adopters the chance to leverage our latest innovation and secure an unparalleled advantage in next-generation hearable design and secure an unparalleled advantage in next-generation hearable design."

Following this expanded programme, SonicEdge will now invite a limited number of new partners onto its sampling initiative. The approach is intended to offer further engineering samples for industry evaluation, with access to direct integration support from the company's engineering team. Devices that use the ST100M are expected to have new form factors and acoustic performance benchmarks distinct from products made using more conventional, discrete components.

Partner engagement

The ST100M sampling programme is restricted to a strategic group of partners deemed qualified by SonicEdge. The stated objective is to support partners to be early adopters of the technology and potentially enter the market ahead of competitors reliant on existing or legacy audio solutions.

Selected partners in the programme will receive hands-on support for integration, as well as engineering samples of the ST100M. The company indicates the module is already under evaluation by current industry partners for use in True Wireless Stereo products and other wearable designs.

SonicEdge was founded by Moti Margalit and Ari Mizrachi in 2019 to develop miniature speakers using silicon-based technology. The company's product development process integrates multiple audio functions into single, compact devices, building on silicon processes widely used across smart device manufacturing. The company states that ongoing advancements in its technology yield increased sound output in smaller volumes with each generation of its products, and that by combining components, design flexibility and performance are enhanced for manufacturers.